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Aiming to fulfill rising demand for on-device AI, Samsung Electronics has begun mass manufacturing for the trade’s thinnest dynamic random entry (DRAM) low-power reminiscence chips.
Samsung stated it’s producing chisp in 12-nanometer (nm)-class, 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages. The units are as skinny as a fingernail, and it’s an instance of how AI is driving demand for brand new sorts of electronics.
Leveraging its experience in chip packaging, Samsung is ready to ship ultra-slim LPDDR5X DRAM packages that may create further house inside cellular units, facilitating higher airflow. This helps simpler thermal management, an element that’s changing into more and more essential particularly for high-performance functions with superior options resembling on-device AI.
“Samsung’s LPDDR5X DRAM units a brand new normal for high-performance on-device AI options, providing not solely superior LPDDR efficiency but in addition superior thermal administration in an ultra-compact bundle,” stated YongCheol Bae, EVP of reminiscence product planning at Samsung Electronics, in an announcement. “We’re dedicated to steady innovation by way of shut collaboration with our clients, delivering options that meet the longer term wants of the low-power DRAM market.”
With the brand new LPDDR5X DRAM packages, Samsung provides the trade’s thinnest 12 nm-class LPDDR DRAM in a 4-stack structure1, decreasing the thickness by roughly 9% and bettering warmth resistance by about 21.2%, in comparison with the earlier era product.
By optimizing printed circuit board (PCB) and epoxy molding compound (EMC)2 methods, the brand new LPDDR DRAM bundle is as skinny as a fingernail at 0.65 millimeters (mm), the thinnest amongst current LPDDR DRAM of 12GB or above. Samsung’s optimized back-lapping3 course of can be used to attenuate the bundle top.
Samsung plans to proceed increasing the low-power DRAM market by supplying its 0.65mm LPDDR5X DRAM to cellular processor makers in addition to cellular gadget producers. As demand for high-performance, high-density cellular reminiscence options in smaller bundle sizes proceed to develop, the corporate plans to develop 6-layer 24GB and 8-layer 32GB modules into the thinnest LPDDR DRAM packages for future units.